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JASCO's Supercritical CO2 Photo Resist Stripping and Wafer Cleaning System offers excellent performance as a cleaning solvent in the photoresist stripping/cleaning/drying processes due to unique properties such as low viscosity, high diffusivity, high permeability and no surface tension.


System Description

The complexity of integrated circuits has been increasing as lithography technology improves. In order to achieve pattern widths in the sub-micrometer range, the method of photoresist stripping and cleaning of silicon wafers is critical.

In addition, the fluid becomes a gas when reducing the pressure to atmospheric at ambient temperature. A liquid solvent can often collapse microstructures with a high aspect ratio due to its high surface tension. On the other hand, supercritical CO2 has no liquid-gas phase boundary and no surface tension occurs, therefore, the fluid can penetrate into microstructures without damaging the lithography pattern.

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